Investigation of Flow and Heat Transfer Performance of Double-Layer Pin-Fin Manifold Microchannel Heat Sinks

The manifold microchannel (MMC) heat sink is characterized by high transfer efficiency, compactness, and low flow resistance. It can be an effective method for the high-flux removal of high-power electronic components. To further enhance performance MMC, a double-layer pin–fin MMC structure was designed. thermodynamic properties, including characteristics, were numerically investigated using ANSYS Fluent with deionized water as working liquid. Compared single-layer temperature uniformity better, pressure drop lower, comprehensive improved at cost slightly larger thermal resistance MMC. geometric effects on also analyzed. results show that among structures round, diamond-shaped, rectangular cross-sections, round pin–fins demonstrate best minimal Under same inlet velocity, decreased, first increased then decreased size increases. In addition, it recommended to adopt height ratio velocity smaller velocity.